Since 1993, Alltemated Inc. has been a leader in the Electronic Manufacturing industry with our Value-Added services and PLACE-N-BOND Underfilm Adhesive. Serving customers around the globe, our services includeTape and Reel, IC Programming, Thermoforming, Laser Marking, Lead Trim and Form, and many other Assembly Services. We also supply and manufacture standard and custom Carrier Tapes. Alltemated is an ISO 9001:2015 registered company located just outside of Chicago,IL. PLACE-N-BOND Underfilm, sets us apart in the Consumer Electronics and OEM markets. This trademarked technology uses pre-formed thermoplastic to edge-bond BGA/CSP/LGA and other packages to the PCB. This helps to improve solder ball/joint reliability, without the need to dispense from a syringe like traditional underfills and adhesives. Pick and Place the exact amount of adhesive precisely where YOU need it with PLACE-N-BOND Underfilm. Let us be your one-stop-shop for all your component preparation Needs!