State of the art Class 3 facility(all processes in house) Unparalleled up front engineering support Dual manufacturing availability(domestic/offshore) Inventory management 24 hour protos, Variety of lead times as required Back drilling and via structures to minimize signal noise High-speed materials ,RF/microwave PCBs Blind and buried via technology Via in pad technology (copper filled and epoxy filled microvias) Complex microvia structures Differential impedance Thermal management solutions, Aluminum or copper heatsink Heavy copper ,High aspect ratio plating Flex (up to 12 layer) and Rigid-Flex (up to 18 layer) Rigid PCBs(up to 34 layer) ITAR Certified, MBE Certified, SDB Rogers complete series, Taconic, Arlon, Nelco, Megtron, Tachyon, ISOLA, Nelco, Teflon, etc.,